PRODUCTS
TEST & MEASUREMENT
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Temptronic ThermoStream Systems, -100 to +300C, no LN2 or LCO2 required
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Sigma Systems Thermal Chambers, -185 to +500C, configured for unique sizes, temperature ranges, transition speeds, and device access
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Sigma Systems Thermal Platforms, -185 to +250C, for rapid, precise transitions of low profile devices including RF, IGBTs, and MOSFETS
9201 Irvine Blvd
Irvine, CA 92618
Phone: 877-922-5427
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Keithley Distribution Products
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Data Acquisition
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Source Measurement Units, DMM, etc.
9201 Irvine Blvd
Irvine, CA 92618
Phone: 877-922-5427
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Keysight Distribution Products
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Oscilloscopes up to 8 GHz (1000, 2000, 3000, 4000, 6000 and S-Series)
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Power Supplies: Bench supplies to rack mount
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Spectrum Analyzer, Field Fox, VNA, SMU, etc.
9201 Irvine Blvd
Irvine, CA 92618
Phone: 877-922-5427
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Tektronix Distribution Products
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Oscilloscopes, Spectrum Analyzers and ARB's
Mixed Signal Oscilloscope
9201 Irvine Blvd
Irvine, CA 92618
Phone: 877-922-5427
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Used Test Equipment for sale, lease or rent
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Most used equipment sold with 1 yr warranty and calibration certificate
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ISO 17025 and ANSI Z-540-1 Calibration laboratory
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Repair services for RF and DC test equipment
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Keysight, Keithley, Tektronix Distribution Products
Semiconductor Device Parameter Analyzer
Parameter Analyzer
Semiconductor Device Parameter Analyzer
631 Montague St
San Leandro, CA 94577
Phone: 510-357-7900
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Global leader in design and manufacturing of Semi-conductor test interface products
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High performance test sockets
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Failure analysis test sockets
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Semi-custom burn-in sockets
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Test probes, socket savers, custom adapters and DUT boards
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Burn-in Systems; turnkey solutions and retrofitting existing systems with drivers and software
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Driver Boards and Burn in Boards (BIB's)
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ATE Services for the V1000/1100/2100, HP82000, HP9470/9472/9473 and HP4062
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ATE System sales for i9470/9472 (formerly the HP9400 series tester)
2601 Texas Dr
Irving, TX 75062
Phone: 972-258-2580
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World Leader in Reliability Test Sockets
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Largest product offering for QFN and Dual Row QFN
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BGA down to 0.5mm pitch
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Memory Sockets including DDRII & DDRIII
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H-pin technology: 6 amp upto 200C with 0.9mm compliance!
BURN-IN & TEST
BACKEND TEST
393 Tomkins Ct.
Gilroy, CA 95020
Phone: 480-755-5567
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Fully automatic probe stations, 100mm - 300mm wafers
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Refurbished Electroglas, spare parts and service
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Complete reconditioning of Electroglas probers with new Apex software and hardware
1228 North Stadem Dr
Tempe, AZ 85281
Phone: 480-968-3459
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Probilt probe card analyzers and repair stations: Manual to fully automatic
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Ergonomic analyzers with greatest measurement resolution, highest throughput and most flexibility
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Probe analyzers dedicated to incoming quality control and repair for cantilever, vertical and MEM's probe card technology
1595 Meadow Ln
Reno, NV 89502
Phone: 775-284-9220
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Non-destructive probe card cleaning and probe shaping material's
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Precision abrasive products for probe card cleaning and probe tip "reforming" and shaping
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Non-destructive cleaning products for sockets (TCC)
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Wafer Chuck Cleaning products for Etcher, Stepper, Lithography and Photo Deposition tools
3000 Laurelview Court
Fremont, CA 94538
Phone: 510-683-9234
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Wafer Level Probe Cards
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Cantilever Production Probe Cards
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Multi-Die Fine Pitch Probe Cards
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Vertical High Parallel Probe Cards
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Probe Stations for wafer and Package devices
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Manual and Semiautomatic
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Probe Head Manipulators and Probe Tip Accessories
FAILURE ANALYSIS
360 Foothill Rd
Bridgewater, NJ 08807
Phone: 800-524-0504
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Emission Microscopy Systems
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Front side and Backside Inspection
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Wafer Package Preparation Systems
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Inverted Emission Microscopy Systems
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Micro-XRF with spot size <10um
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Industry leading 50kV/50W/1mA x-ray tube
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Largest active detector area; 30mm^2 to 150mm^2
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Motorized X,Y and Z stage; speed up to 300mm/s with accuracy <1um
417A Salinas Rd
Royal Oaks, CA 95076
Phone: 831-761-7980
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JetEtch; Automated Acid Decapsulation
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CuProtect system designed specifically to preserve copper bond wires during etch
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TotalProtect offers all the features of the CuProtect with the added functionality of hot and cold temperature control
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PlasmaEtch is a directional plasma etched designed to rapidly etch selective materials.
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World leader of Micro cleaving tools to achieve high accuracy and high quality cleaving
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Benchtop manual and semi-automatic cleaving tools
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SEM Sample Preparation of Crystalline Materials with High quality, High Accuracy and High Throughput
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TEM sample preparation tools using Adaptive Ion Milling Technology
2149 E. Pratt Blvd
Elk Grove Village, IL 60007
Phone: 847-437-6400
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Non-Destructive internal Failure Analysis Inspection and analysis using Acoustic Microscopy and Acoustic Micro Imaging (AMI) technology
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GEN6 Delivers the broadest range of capabilities and the most advanced features.
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D24 Series: 24” x 24” scanning area perfectly suited for large area samples, component inspection on PC boards and multiple JEDEC trays
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D9600 Ideal for failure analysis, process development and material characterization
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AW300 Series: Automatically handles, inspects and sorts bonded wafers
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SonoLab services: Materials Characterization and Qualification, High-Capacity Screening and Lot Reclamation, Failure Analysis, Inspection and Audit Services and Training
721 Visions Dr
Skaneateles, NY, 13152
Phone: 832-325-4368
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2D/3D x-ray
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Computed Topography
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Non-destructive Failure Analysis
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Metrology
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Production Solutions
SMT, BONDING & TEST
2895 Greenspoint Parkway
Suite 200
Hoffman Estates IL 60169
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Automated Optical Inspection (AOI)
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Solder Paste Inspection (SPI)
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Automated Xray Inspection (AXI)
1701 Gold Rd
Suite 3-1200
Rolling Meadows, IL 60008
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Scalable Any Mix, Any Volume Pick-n-Place, Laser Markers and Screen Printer for SMT Line
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PanaCIM Sofware Modules for Data Managment
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Integrated or Complete Solutons
1046 W. London Park Dr
Forest, VA 24551
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Material Handling and Automation Systems
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Edge Belt, Tabletop, Mat Top, Optical, Air and Cap conveyor's
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Board unload/Loaders
Einsteinstraße 10
85757 Karlsfeld
Munich, Germany
Phone: +49 (0) 8131 7573 50
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TPT develops, manufactures & distributes high quality wire bonders.
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They offer Wedge-, ball-, stud-bump-, stitch-and ribbon bonding.
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Wire sizes are 17μ to 70μ Gold-and Aluminum Wire
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Gold ribbon up to 25μ x 200μ
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Heavy wire bonder: wires from100μ-500μ Aluminum
It comes with a motorized Z - Axis, with this Die Bonder, die bonding tasks can be handled with ease and precise.
It comes with a motorized Z - Axis, with this Die Bonder, die bonding tasks can be handled with ease and precise.
36 Balch Ave
Groveland, MA 01834
Phone: 978-373-4292
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Bond Testers, flexible and configurable for large variety of test
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Ball shear, solder shear, bending, cavity shear, cold bump pull, die shear, fatigue, high speed impact, lead integrity, lid torque, overhanging die, passivation layer gold ball shear, ribbon peel, ribbon pull, stud pull, total ball shear, zone shear, tweezer pull, vector pull, wedge and ribbon shear, wire pull, etc.
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Contact
Headquarters
5291 NE Elam Young Pkwy
Suite 190
Hillsboro, OR 97124
Links
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